Thursday
07.18.2019
11:16 PM
Login form
Search
Calendar
«  February 2013  »
SuMoTuWeThFrSa
     12
3456789
10111213141516
17181920212223
2425262728
Entries archive

Africa Live News

Main » 2013 » February » 10 » Toshiba Starts Sample Shipment of Industry's First[1] Embedded NAND Flash Memory Modules
10:31 AM
Toshiba Starts Sample Shipment of Industry's First[1] Embedded NAND Flash Memory Modules
--JEDEC UFS[2] Ver.1.1 Standard Compliant Embedded Memories Combine up to 64GB NAND and a Controller in a Single Package--

TOKYO - Friday, February 8th 2013 [BUSINESS WIRE/ ME NewsWire]

Toshiba Corporation (TOKYO:6502) today announced that it has started sample shipments of a 64-gigabyte (GB) embedded NAND flash memory module, the first in the industry equipped with a UFS I/F. The module is fully compliant with the JEDEC UFS Ver.1.1 standard[3] and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs.

Samples are mainly intended for evaluation of UFS I/F and its protocol in host chipsets and by OS vendors.

Demand continues to grow for large density, high-performance chips that support high resolution video, driven by improved data-processing speeds in host chipsets and wider bandwidths for wireless connectivity.

Toshiba has proved itself an innovator in this key area, and is now reinforcing its leadership by being first in the industry to support samples with a 64GB UFS module.

Toshiba will schedule mass-production and other densities in its line-up according to market demand.
 

Product

Part Number
          

Density
          

Package
          

Sample shipment

THGLF0G9B8JBAIE
          

64GB
          

169Ball 12×16×1.2mm FBGA
          

January 2013
                                    

Key Features

    The JEDECUFSVer.1.1 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
    UFS I/F has a serial I/F. It has the scalability in number of lanes and speed[4].
    The new products are sealed in a small FBGA package, 12x16x1.2mm, and have a signal layout compliant with JEDEC UFSVer.1.1.

[1]
          

For embedded NAND flash memory modules. Source: Toshiba, as of February 2013.

[2]
          

Universal Flash Storage is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.

[3]
          

JEDEC UFS Ver.1.1 standard has already been published. The Ver.2.0 standard is now under discussion by JEDEC.

[4]
          

JEDEC UFS Ver.2.0 standard will support multiple-lane and I/F speed.
            

Specifications

Interface
          

JEDECUFS Version 1.1 standard

Power Supply Voltage
          

2.7V to 3.6V (Memory core)

1.70V to 1.95V (Controller core)

1.10V to 1.30V (UFS I/F signals)

Number of lane
          

Downstream 1lane / Upstream 1lane

I/F Speed
          

2.9Gbps/lane

Temperature range
          

-25degrees to +85degrees Celsius

Package
          

169Ball 12x16x1.2mm FBGA,
            

About Toshiba

Toshiba is a world-leading diversified manufacturer, solutions provider and marketer of advanced electronic and electrical products and systems. Toshiba Group brings innovation and imagination to a wide range of businesses: digital products, including LCD TVs, notebook PCs, retail solutions and MFPs; electronic devices, including semiconductors, storage products and materials; industrial and social infrastructure systems, including power generation systems, smart community solutions, medical systems and escalators & elevators; and home appliances.

Contacts

Toshiba Semiconductor & Storage Products Company

Megumi Genchi / Kunio Noguchi, +81-3-3457-3367

Views: 81 | Added by: uaeonlinenews | Rating: 0.0/0
Total comments: 0