ME NewsWire / BusinessWire
BALZERS, Liechtenstein - Thursday, October 3rd 2013
Oerlikon Advanced Technologies, a leading supplier of PVD deposition
equipment, has today set a new standard with the CLUSTERLINE® 300 as
the first 300mm system worldwide running thin wafer backside
metallization (BSM) for power devices in production.
Following the successful qualification by a leading power device
manufacturer, Oerlikon has received multiple orders for the
CLUSTERLINE® 300 for production of 300mm power devices.
The new developed processes for devices like Metal Oxide
Semiconductor Field-Effect Transistors (MOSFETs) offer the same
behavior as those qualified on 200mm wafers and enable power device
manufacturers to produce devices much more efficiently.
With the CLUSTERLINE® 300, Oerlikon has successfully overcome the
significant challenges associated with transitioning the <
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